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Morgan StanleyHong KongClosed

2027 Technology Summer Analyst Program (Hong Kong)

Programme

Internship

Location

Hong Kong

Duration

10 weeks

Deadline

2026-08-16

About the role

Join Morgan Stanley's 10-week Technology Summer Analyst Program in Hong Kong to gain hands-on experience in application development, cybersecurity, and enterprise engineering. Work on impactful projects and develop technical and professional skills in a collaborative environment.

Program Highlights

  • 10-week summer internship from June to August 2027 in Hong Kong.
  • One-day orientation introducing the Firm's businesses and culture.
  • Personalized mentoring and technical demonstrations.
  • Team-building activities and social events.
  • Participation in community service initiatives.
  • Work on live projects with real business impact.

Role and Responsibilities

  • Collaborate across application development, cybersecurity, and enterprise engineering teams.
  • Design, build, enhance, and protect technology powering the Firm and clients.
  • Solve real business problems with impactful technology solutions.
  • Gain exposure to diverse technologies and global scale delivery.
  • Lead and contribute to projects including AI-enabled applications and cyber defenses.
  • Support enterprise infrastructure to ensure efficient and secure operations.

Qualifications and Skills

  • Pursuing Bachelor's, Master's, or Doctoral degree graduating between Oct 2027 and Jul 2028.
  • Majors: Computer Science, Engineering, Data Science, Mathematics, or related technical fields.
  • Strong problem-solving, analytical, communication, and collaboration skills.
  • Proficiency in programming languages like Python, Java, C++, or similar.
  • Understanding of AI concepts including prompt engineering and applied AI.
  • Familiarity with Linux/Unix, Windows, OOP, data structures, algorithms, databases, and scripting.

Application Process and Deadlines

  • Submit CV and complete online assessment.
  • Participate in on-demand video interview and Superday.
  • Application deadlines: 2026-08-16 and 2026-09-27 at 23:55 HKT.
  • Ongoing recruitment; early application encouraged.